Subject description
- Rheology of polymers and adhesives for wood bonding
- Viscoelastic properties of adhesives
- Creep and relaxation in adhesive bonds
- Elastic and viscous shear modulus
- Glass transition temperature
- Transitions during of curing of thermosetting adhesives.
- Rheology of hot-melt adhesives
- Analysis of adhesive cure
- Influence of time and temperature on adhesive cure
- Curing kinetics of urea-formaldehyde, melamine-formaldehyde in phenol-formaldehyde adhesive with DSC
- Dielectric analysis of adhesives
- Dynamical mechanical analysis of adhesives
- Automated bonding evaluation system
- Modelling of curing process of adhesives at hot-pressing, MFK in AMFK
The subject is taught in programs
Objectives and competences
The objective of the course is to get deep and detailed knowledge about rheological properties of wood adhesives and to understand mechanisms of adhesion when bonding of wood and/or other materials. Get familiar with analytical methods for studying the curing of adhesives and to become qualified for scientific research in the field of bonding. Get knowledge for analysis and modelling of the curing process of adhesives with the software.
Teaching and learning methods
Lectures (10 hours) and seminar (30 hours) in multimedia equipped lecture rooms.
Expected study results
Knowledge and understanding:
The student understands the meaning of rheological properties of adhesives for achievement of sufficient adhesion at bonding of wood and other materials. He/she understands the effect of bonding parameters on the curing kinetics of adhesives. He/she knows methods for monitoring and analysing the process of curing of adhesives and strength properties of adhesive bonds.
Use:
Knowledge allows student to understand the technology of wood bonding and bonding of other materials. Knowledge can be used in development of new adhesive and bonding processes. Student is capable of conducting the comprehensive tests and studies with laboratory instruments and equipment.
Reflection:
Knowledge about wood adhesives, technology of bonding of wood and other materials, and complex methods for research in the field of rheology of adhesives and bonding.
Transferable skill:
Student gets skills how to use scientific literature and prepare a scientific paper. Upgrade and transfer of gained knowledge at all technology related courses.
Basic sources and literature
1. Pizzi, A., Mittal, K.L. 2017. Handbook of Adhesive Technology. CRC Press, Boca Raton, 658 str. (izbrana poglavja)
2 Mulligan, D. 2003. Cure monitoring for composites and adhesives. Rapra Technology, Shawbury, 112 str. (izbrana poglavja)
3. Runt, P.J., Fitzgerald, J.J. 1997. Dielectric Spectroscopy of Polymeric Materials: Fundamentals and Applications, ACS, Washington, 461 str. (izbrana poglavja)
4. Whorlow, R.W. 1992. Rheological techniques. Ellis Horwood, New York, 460 str. (izbrana poglavja)
5. Revijalni članki s področja, tekoča periodika, druga učna gradiva…
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