Realisation of Electronic Circuits

Subject description

Basic principles of design and construction of the electronic systems. Development cycle of products. Costs and incomes, internal rate of return. Cumulative profit.

Tolerance, yield and waste. Permissible and tolerance range. Distribution functions, normal distribution. Tolerances of several parameters. Tolerance analyses.

Reliability and system reliability computation.

Environmental factors and modelling the effects of: temperature, humidity, voltage, temperature cycles. Measurement of reliability.

Reserve systems and fault tolerant design. Backup systems and reserves. Redundancy.

Standardisation. European legislation in the field of free movement of goods. The CE marking. Using standards in the design process of electronic systems. Safety standards and standards in the field of EMC.

EMI model and interference paths. Near and far electromagnetic field, differential and single ended signals. Measurement techniques and equipment for EMC.

Materials, properties and technologies of PCBs. Flexible PCBs and buried passive components.

Design techniques for EMC. Radiation of PCB. Signal loops. Ground connection. EMI reduction. The critical size of loops. Mirror plane and the return paths. Signal integrity in PCBs. Signal propagation speed, critical dimensions and frequencies. Fast transfer of signals on the lines and losses. Power supply blocking and filtering. Capacitance of power supply planes in PCBs.

Heat transfer principles. Thermal management of electronic devices and systems.

The subject is taught in programs

Objectives and competences

To understand the electrical and mechanical phenomena that are present in the design process of electronic systems. Develops the ability to design and realize PCB assemblies that comply with standards and legislation. Students get acquainted with procedures of electronic system design from technical and business perspective.

Teaching and learning methods

Lectures, laboratory practice.

Expected study results

On successful completion of this module, students should be able to

recognize materials and technology for the manufacturing and assembly of printed circuit boards.
design a printed circuit board according to the given scheme with respect to good engineering practice to achieve compatibility with the applicable standards and to the production technologies.
calculate the reliability of the apparatus on the basis of the reliability of components
consider valid standards to which the device must comply according to the currently valid legislation and the type of the device.
use computer programs for the simulation and design of electrical schemes and printed circuit boards.
select the best topology and the termination of the electrical connections according to the type of signal.
identify the most likely source of problems related to electromagnetic compatibility in the circuit and suppress it with the most appropriate means.
design appropriate cooling system to remove excessive heat

Basic sources and literature

Jankovec M., Realizacija elektronskih sklopov, slikovno gradivo in zapiski predavanj, Ljubljana, 2016.
Pirc M., Jankovec M., Realizacija elektronskih sklopov, laboratorijske vaje, Ljubljana, 2013.
Peršič B., Realizacija elektronskih sklopov, Založba FE, Ljubljana, 1998.
Henry W. Ott, Electromagnetic Compatibility Engineering, Wiley-Interscience, ISBN 978-0-470-18930-6, New York, 2009.
Howard W. Johnson, Martin Graham, High-Speed Digital Design, A Handbook of Black Magic, Prentice Hall PTR, New Jersey
Lee. W. Ritchey, Right the first time, Speeding edge, ISBN-0-9741936-0-7, 2003
Mark I. Montrose, Printed Circuit Board Design Techniques for EMC Compliance, Wiley-Interscience IEEE, ISBN 0-7803-5376-5, New York, 2000.
Mark I. Montrose, EMC and the Printed Circuit Board – Design, Theory and -Layout Made Simple, Wiley-Interscience IEEE, ISBN 0-7803-4703-N, New York, 1996.
Tim Williams, EMC for Product Designers, Third edition, ISBN 0 7506 4930 5, 2001.