Integrated High-Frequency Circuits

Course description

  • Introduction: spectrums, ranges, electrical dimensions, technologies. 
  • RF systems: WLAN, GSM, GPS, Sensors, RF Biomedical systems, research equipment (NMR), common RF modules. 
  • Introduction to the basic theory: waves, lines, abstract models, S and X parameters, impedance and admittance matrices, ABCD matrix, Smith chart, tuning, modelling, CAD tools, RF simulations. 
  • Design of RF modules: Modelling, CADENCE environment, simulations, design of passive and active RF circuits. 
  • Basics of electromagnetic compatibility: Introduction, suppressing EMC emission, protection against EMC interference, EMC compatibility, CAD tools. 

Course is carried out on study programme

2nd Cycle Postgraduate Study Programme in Electrical Engineering

Objectives and competences

Understanding and the specific RF elements, RF circuits and RF systems usage and specific methods of analysis, synthesis, and design using CAD tools. In addition, the students will be able to analyze and use the basic HF circuits and systems characteristics and the basic concepts of Electromagnetic compatibility. 

Learning and teaching methods

Lectures and laboratory work composed of two parts: the use of CAD tools for design of RF circuits. 

Intended learning outcomes

After successful course completion, the students should be able to: 

  • Understand the operation of integrated high frequency circuits and systems and identifying common modules, 
  • Use of the theory of transmission lines at high frequency integrated circuits design, 
  • Use of the Smith Chart and the theory of matching elements and circuits at high frequencies, 
  • Design of simple circuits, which operate at high frequencies, 
  • The use of small signal linear and nonlinear parameters at analysis, synthesis and design of high frequency circuits, 
  • The use of signal flow-graphs during analysis and design of integrated high frequency circuits 
  • Design of simple passive and active circuits 
  • The use of modern CAD tools during analysis, synthesis and design of HF circuits 
  • Understanding of the influence of HF signals to electronic circuits. 

Reference nosilca

  1. SEŠEK, Aleksander, BERČAN, Damjan, GRADIŠEK, Miha, ŠVIGELJ, Andrej, TRONTELJ, Janez. A THz receiver with novel features and functionality. Sensors, ISSN 1424-8220, Nov. 2018, vol. 18, no. 11, str. 1-10, ilustr. https://www.mdpi.com/1424-8220/18/11/3793
  2. SEŠEK, Aleksander, CHAMBERS, Olga, TRONTELJ, Janez. Study on the die-attach voids distribution with X-ray and image processing techniques. Journal of electronic packaging : Transactions of the ASME, ISSN 1043-7398, Mar. 2019, vol. 141, no. 2, str. 1-7, ilustr.http://electronicpackaging.asmedigitalcollection.asme.org/article.aspx?articleID=2724836
  3. CHAMBERS, Olga, SEŠEK, Aleksander, RAŽMAN, Rok, TASIČ, Jurij F., TRONTELJ, Janez. Fertiliser characterisation using optical and electrical impedance methods. Computers and electronics in agriculture, ISSN 0168-1699. [Print ed.], Dec. 2018, vol. 155, str. 69-75, ilustr.https://www.sciencedirect.com/science/article/pii/S0168169918307956
  4. KAŠALYNAS, Irmantas, VENCKEVIČIUS, Rimvydas, MINKEVIČIUS, Linas, SEŠEK, Aleksander, WAHAIA, Faustino, TAMOŠIUNAS, Vincas, VOISIAT, Bogdan, SELIUTA, Dalius, VALUŠIS, Gintaras, ŠVIGELJ, Andrej, TRONTELJ, Janez. Spectroscopic terahertz imaging at room temperature employing microbolometer terahertz sensors and its application to the study of carcinoma tissues. Sensors, ISSN 1424-8220, Apr. 2016, vol. 16, no. 4, str. 1-15, ilustr. http://www.mdpi.com/1424-8220/16/4/432
  5. SEŠEK, Aleksander, ŽEMVA, Andrej, TRONTELJ, Janez. A microbolometer system for radiation detection in the THz frequency range with a resonating cavity fabricated in the CMOS technology. Recent patents on nanotechnology, ISSN 1872-2105, 2017, vol. 11, no. 3, str. 1-11, ilustr.http://www.eurekaselect.com/153696/article

Study materials

  1. M. Steer, Microwave and RF design, A systems approach, SciTech publishing, 2013. 
  2. G. B. Roberto Sorentino, Microwave and RF Engineering, New York: Wiley, 2010. 
  3. D. M. Pozar, Microwave engineering, Wiley, 2012. 
  4. B. Razavi, RF microelectronics, New York: Pearson international, 2012. 
  5. R. C. Paul, Electromagnetic compatibility, Wiley, 1992. 
  6. Kostevc, D. Poglavja iz mikrovalov, Založba FE in FRI, Ljubljana, 2005 
  7. Kopije prosojnic predavanj in navodila za laboratorijske vaje/Copies of lecture slides and instructions for laboratory exercises http://lniv.fe.uni-lj.si/courses/ivvf/IVVF_Lectures2223.pdf 

 

Bodi na tekočem

Univerza v Ljubljani, Fakulteta za elektrotehniko, Tržaška cesta 25, 1000 Ljubljana

E:  dekanat@fe.uni-lj.si T:  01 4768 411